Current status of student majors

학생현황 - 학생분류, 인원, 평균 입학연령 및 평균 졸업기간, 연령 및 기간 정보제공
Type Number of Students Avg. age of admission &
Avg. graduation period		 Age & period
Enrolled Students 10 Average age of new students in master course 25.49
Students on leave 5 Average age of new students in doctor course 28.02
Completion Students 19 Average age of new students in integrative course 25.93
Master Graduates 222 Average graduation period in master course 2.16
Doctoral Graduates 72 Average graduation period in doctor course 5.33
International Students 1 Average graduation period in inegrative course 6.82

Student Research Performance

게시물검색
학생연구실적 - 연도, 연구실적 구분, 게재지, 연구실적명 정보제공
Year Field of Research Journal Research
2011 Journal ELECTROCHEMICAL AND SOLID STATE LETTERS Antireflection Properties of Al2O3 and AlxTi1?xOy Films on ZnO:Ga Coated Si Wafer for Thin-Film Solar Cell
2011 Journal Journal of The Electrochemical Society Effect of Deposition Conditions and Crystallinity of Substrate on Phase Transition of Hydrogenated Si Films
2011 Journal Current Applied Physics Effect of RF-power Density on the Resistivity of Ga-doped ZnO Film Deposited by RF-magnetron Sputter Deposition Technique
2011 Journal Current Applied Physics Effect of rf-power density on the resistivity of Ga-doped ZnO film deposited by rf-magnetron sputter deposition technique
2011 Journal Thin Solid Films Etching characteristics and mechanism of ZnO thin films in inductively coupled HBr/Ar plasma
2011 Journal ELECTROCHEMICAL AND SOLID STATE LETTERS Fabrication of p-type ZnO Thin Films Using rf-Magnetron Sputter Deposition
2011 Journal Japanese Journal of Applied Physics High-Performance Transparent Conducting Ga-Doped ZnO Films Deposited by RF Magnetron Sputter Deposition
2011 Journal Japanese Journal of Applied Physics High-Performance Transparent Conducting Ga-doped ZnO films Deposited by RF magnetron Sputter Deposition
2011 Journal Materials letters Influence of seed layers on the vertical growth of ZnO nanowires
2011 Journal ETRI Journal Novel bumping material for solder-on-pad (SoP) technology